āhuatanga hua
MOMO
WHAKAMAHI
kāwai
Iahiko Whakakotahi (IC)
Tāmau – Pūnaha ki runga Tipi (SoC)
kaihanga
AMD Xilinx
raupapa
Zynq®-7000
Mōkī
paepae
Tūnga Hua
kei roto i nga taonga
Hangahanga
MCU, FPGA
pūtukatuka matua
ARM® Cortex®-A9 MPCore™ me CoreSight™
Rahi kohiko
-
Rahi RAM
256KB
Pikitia
DMA
Hononga
CANbus, EBI/EMI, Itarangi, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
tere
800MHz
huanga matua
Kintex™-7 FPGA, 350K pūtau arorau
Te pāmahana whakahaere
-40°C ~ 100°C (TJ)
Mōkī/Kainga
676-BBGA, FCBGA
Kaituku Pūrere Packaging
676-FCBGA (27×27)
Tatau I/O
130
Tau hua taketake
XC7Z045
Media me nga Tikiake
TE MOMO RAUEMI
LINK
Whakatakotoranga
Zynq-7000 Tirohanga Katoa o te SoC Ka taea te Papatono
XC7Z030,35,45,100 Pepa Raraunga
Zynq-7000 Aratohu Kaiwhakamahi
Ko nga waahanga whakangungu hua
Whakamana Rangatū 7 Xilinx FPGAs me TI Power Management Solutions
Nga korero mo te taiao
Xiliinx RoHS Tiwhikete
Xilinx REACH211 Tiwhikete
Nga Hua kua tohua
Katoa Zynq®-7000 SoC ka taea
PCN Hoahoa/Whakaahuatanga
Hua Tohu Chg 31/Oct/2016
Rauemi Multi Dev Chg 16/Dec/2019
Puka PCN
Pūrere Maha 26/Hun/2017
Errata
Zynq-7000 Errata
Taiao me te Whakarōpū Kaweake
NGA HUanga
WHAKAMAHI
Te mana RoHS
E rite ana ki nga whakaritenga ROHS3
Taumata Makuku (MSL)
3 (168 haora)
mana REACH
Nga hua kore-REACH
ECCN
3A991D
HTSUS
8542.39.0001
