āhuatanga hua
MOMO
WHAKAMAHI
kāwai
Iahiko Whakakotahi (IC)
Tāmau – Pūnaha ki runga Tipi (SoC)
kaihanga
AMD Xilinx
raupapa
Zynq® UltraScale+™ MPSoC CG
Mōkī
paepae
Tūnga Hua
kei roto i nga taonga
Hangahanga
MCU, FPGA
pūtukatuka matua
Taurua ARM® Cortex®-A53 MPCore™ me CoreSight™, Taurua ARM® Cortex™-R5 me CoreSight™
Rahi kohiko
-
Rahi RAM
256KB
Pikitia
DMA, WDT
Hononga
CANbus, EBI/EMI, Itarangi, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
tere
533MHz, 1.3GHz
huanga matua
Zynq® UltraScale+™ FPGA, 103K+ pūtau arorau
pāmahana whakahaere
-40°C ~ 100°C (TJ)
Mōkī/Kainga
784-BFBGA, FCBGA
Kaituku Pūrere Packaging
784-FCBGA (23×23)
Tatau I/O
252
Tau hua taketake
XCZU2
Media me nga Tikiake
TE MOMO RAUEMI
LINK
Whakatakotoranga
Zynq UltraScale+ MPSoC Overview
Nga korero mo te taiao
Xiliinx RoHS Tiwhikete
Xilinx REACH211 Tiwhikete
Tauira EDA/CAD
XCZU2CG-2SFVC784I na SnapEDA
Taiao me te Whakarōpū Kaweake
NGA HUanga
WHAKAMAHI
Te mana RoHS
E rite ana ki nga whakaritenga ROHS3
Taumata Makuku (MSL)
4 (72 haora)
mana REACH
Nga hua kore-REACH
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
